Prime & Bond XP Unit Dose Refill 100/Pk ProductFamily_Wire Mesh Basket A placement instrument that features

A placement instrument that features a flexible adhesive tip

Ready for arch wires in seconds

the materials thin layer thickness of only 20µm is an advantage as well

Defend Alginate Subsitute 50ml RS 6/Bx

Prime & Bond XP Unit Dose Refill 100/Pk ProductFamily_Wire Mesh Basket A placement instrument that featuresPrime&Bond XP is a universal Etch&Rinse Adhesive designed to bond resin based light cured restorative materials to enamel and dentin. Prime&Bond XP stands for extra performance due to high bond strength on enamel and dentin, easy and comfortable application and a high degree of technique tolerance. Light curing of Prime&Bond XP is not required when used in conjunction with Self Cure Activator (SCA) and DENTSPLY manufactured dual or self cure resin